US Patent Issued to SAMSUNG ELECTRONICS on July 22 for "Semiconductor device including a support layer with openings" (South Korean Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,369,309, issued on July 22, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor device including a support layer with openings" was invented by Jongmin Lee (Hwaseong-si, South Korea) and Hoonmin Kim (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device may include lower electrodes on a substrate, a first upper support layer pattern on upper sidewalls of the lower electrodes, and a dielectric layer and an upper electrode on surfaces of the lower electrodes and the first upper support layer pattern. The lower electrodes may be in a honeycomb pattern with the lower electrodes are...