US Patent Issued to SAMSUNG ELECTRONICS on July 15 for "Semiconductor package comprising semiconductor chip with stepped portion" (South Korean Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,318, issued on July 15, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package comprising semiconductor chip with stepped portion" was invented by Seunghyun Baik (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a substrate extending in a first direction and a second direction perpendicular to the first direction, a first semiconductor chip disposed on the substrate, the first semiconductor chip having a stepped portion, a second semiconductor chip disposed on the substrate and horizontally spaced apart from the first semiconductor chip in the first direction, a ...