US Patent Issued to SAMSUNG ELECTRONICS on July 15 for "Semiconductor package and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,344, issued on July 15, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method of manufacturing the same" was invented by Juhyeon Kim (Cheonan-si, South Korea), Hyoeun Kim (Cheonan-si, South Korea) and Sunkyoung Seo (Cheonan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor package includes preparing a wafer structure having a first semiconductor substrate and a plurality of first front surface connection pads. A lower semiconductor chip having a preliminary semiconductor substrate and a plurality of second front surface connection pads are attach...