US Patent Issued to SAMSUNG ELECTRONICS on July 15 for "Semiconductor package and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,328, issued on July 15, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor package and method of fabricating the same" was invented by Jaekyung Yoo (Seoul, South Korea), Jayeon Lee (Seongnam-si, South Korea), Jae-eun Lee (Hwaseong-si, South Korea), Yeongkwon Ko (Hwaseong-si, South Korea), Jin-woo Park (Seoul, South Korea) and Teak Hoon Lee (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are semiconductor packages and/or methods of fabricating the same. The semiconductor package comprises a package substrate, a first semiconductor chip mounted on the package substrate, a second s...