US Patent Issued to SAMSUNG ELECTRONICS on July 15 for "Semiconductor package and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,253, issued on July 15, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method of fabricating the same" was invented by Hyeonjeong Hwang (Cheonan-si, South Korea), Dongkyu Kim (Anyang-si, South Korea), Minjung Kim (Cheonan-si, South Korea) and Taewon Yoo (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a package substrate; a first semiconductor chip disposed on the package substrate; a heat-dissipation pattern disposed on the first semiconductor chip; a first mold layer disposed on the package substrate and at least partially surrounding the first se...