US Patent Issued to SAMSUNG ELECTRONICS on July 15 for "Printed circuit board and semiconductor package including the same" (South Korean Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,286, issued on July 15, was assigned to SAMSUNG ELECTRONICS Co. LTD. (South Korea).

"Printed circuit board and semiconductor package including the same" was invented by Byeonguk Jeon (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package may include a board, a first semiconductor chip mounted on the board, and a plurality of second semiconductor chips stacked on the first semiconductor chip. The board may include alignment marks on a top surface of the board and which are arranged in spaced apart relationship along a first direction. Each alignment mark includes a first side surface parallel to the first direction...