US Patent Issued to SAMSUNG ELECTRONICS on July 15 for "Camera module for heat dissipation and ground and electronic device including the same" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,363,406, issued on July 15, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Camera module for heat dissipation and ground and electronic device including the same" was invented by Minki Cho (Suwon-si, South Korea), Jungsoo Kim (Suwon-si, South Korea), Dohyun Ahn (Suwon-si, South Korea), Wonchul Cho (Suwon-si, South Korea), Taeyun Kim (Suwon-si, South Korea), Wonjun Jeong (Suwon-si, South Korea), Kwangsic Choi (Suwon-si, South Korea) and Chonguk Heo (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A camera module includes: a printed circuit board having a conductive pad exposed on one surface of the printed cir...