US Patent Issued to SAMSUNG ELECTRONICS on July 1 for "Sensor package and method of manufacturing the same" (South Korean Inventor)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,349,490, issued on July 1, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Sensor package and method of manufacturing the same" was invented by Sunjae Kim (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A sensor package includes: an image sensor including a body layer having an upper surface and a lower surface, opposite to the upper surface, a pixel layer disposed on the upper surface, a microlens array disposed on the pixel layer, a connection terminal disposed on the lower surface, and a through-via extending between the upper surface and the lower surface and electrically connected to the connection terminal;...