US Patent Issued to SAMSUNG ELECTRONICS on July 1 for "Semiconductor package including uneven structures and electronic device including the same" (South Korean Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,795, issued on July 1, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including uneven structures and electronic device including the same" was invented by Bonggyu Kang (Yongin-si, South Korea), Yongha Kim (Seongnam-si, South Korea), Youngsoo Jang (Suwon-si, South Korea), Heesu Kim (Suwon-si, South Korea), Kwangsoo Park (Suwon-si, South Korea) and Junsik Park (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package board, at least one semiconductor chip disposed on the package board, a molding member disposed on the package board and at least partial...