US Patent Issued to SAMSUNG ELECTRONICS on July 1 for "Semiconductor package and substrate for semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,759, issued on July 1, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor package and substrate for semiconductor package" was invented by Jin Mo Kwon (Yongin-si, South Korea), Dong Uk Kim (Seoul, South Korea) and Jin Hee Hong (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a substrate; a semiconductor chip on a first surface of the substrate; and a plurality of external connection terminals on a second surface of the substrate that is opposite to the first surface. The substrate includes a plurality of wirings configured to electrically connect the semicon...