ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,768, issued on July 1, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor device including via structure" was invented by Anthony Dongick Lee (Hwaseong-si, South Korea), Sangcheol Na (Seoul, South Korea), Kichul Park (Suwon-si, South Korea), Doohwan Park (Yongin-si, South Korea), Kyoungwoo Lee (Hwaseong-si, South Korea), Rakhwan Kim (Suwon-si, South Korea), Yoonsuk Kim (Hwaseong-si, South Korea), Jinnam Kim (Anyang-si, South Korea), Hoonjoo Na (Seoul, South Korea), Eunji Jung (Hwaseong-si, South Korea) and Juyoung Jung (Yongin-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device inclu...