US Patent Issued to SAMSUNG ELECTRONICS on July 1 for "Semiconductor device including support structure, method for manufacturing the same and electronic system including the same" (South Korean Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,349,348, issued on July 1, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device including support structure, method for manufacturing the same and electronic system including the same" was invented by Seugmin Lee (Seoul, South Korea), Kiyoon Kang (Seoul, South Korea), Kangmin Kim (Hwaseong-si, South Korea), Dongseong Kim (Seoul, South Korea), Junhyoung Kim (Seoul, South Korea) and Byungkwan You (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device of the disclosure includes a peripheral circuit structure including a peripheral transistor, a semiconductor layer on the peripheral ci...