US Patent Issued to SAMSUNG ELECTRONICS on July 1 for "Semiconductor device and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,349,404, issued on July 1, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device and method of fabricating the same" was invented by Donghyuk Yeom (Seoul, South Korea), Kwan Heum Lee (Suwon-si, South Korea), Seonghwa Park (Seoul, South Korea) and Sechan Lim (Boryeong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a semiconductor device and a method of fabricating the same. The semiconductor device includes an active pattern on a substrate, a device isolation layer provided on the substrate to define the active pattern, a pair of source/drain patterns on the active pattern and a channel p...