US Patent Issued to SAMSUNG ELECTRONICS on July 1 for "Interconnection structure and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,760, issued on July 1, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Interconnection structure and semiconductor package including the same" was invented by Junyun Kweon (Cheonan-si, South Korea), Jumyong Park (Suwon-si, South Korea), Jin Ho An (Seoul, South Korea), Dongjoon Oh (Suwon-si, South Korea), Jeonggi Jin (Seoul, South Korea) and Hyunsu Hwang (Siheung-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are interconnection patterns and semiconductor packages including the same. The interconnection pattern comprises a first dielectric layer, a first interconnection pattern in the first dielectric l...