ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,774, issued on July 1, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Integrated circuit devices including metal lines spaced apart from metal vias, and related fabrication methods" was invented by Janggeun Lee (Delmar, N.Y.), Jaemyung Choi (Niskayuna, N.Y.), Wonhyuk Hong (Clifton Park, N.Y.) and Kang-ill Seo (Albany, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuit devices are provided. An integrated circuit device includes a first insulating layer and a metal via that is in the first insulating layer. The integrated circuit device includes a second insulating layer on the first insulating layer. The int...