US Patent Issued to SAMSUNG ELECTRONICS on July 1 for "Ground-connected supports with insulating spacers for semiconductor memory capacitors and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,349,339, issued on July 1, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Ground-connected supports with insulating spacers for semiconductor memory capacitors and method of fabricating the same" was invented by Yoon Young Choi (Seoul, South Korea), Seung Jin Kim (Hwaseong-si, South Korea), Byung-Hyun Lee (Hwaseong-si, South Korea) and Sang Jae Park (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device may comprise: a plurality of lower electrodes which are on a substrate; a first electrode support which is between adjacent lower electrodes and comprises a metallic material; a dielectric laye...