US Patent Issued to SAMSUNG ELECTRONICS on July 1 for "Equipment front end module and destructive analysis automation apparatus including the same" (South Korean Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,343,881, issued on July 1, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Equipment front end module and destructive analysis automation apparatus including the same" was invented by Youn Gon Oh (Hwaseong-si, South Korea), Sae Yun Ko (Hwaseong-si, South Korea), Gil Ho Gu (Hwaseong-si, South Korea), Dong Su Kim (Incheon, South Korea), Ji Hun Kim (Uiwang-si, South Korea), Sang Hyuk Park (Yongin-si, South Korea), Eun Hee Lee (Hwaseong-si, South Korea), Ho Chan Lee (Seoul, South Korea), Seong Sil Jeong (Incheon, South Korea) and Seong Pyo Hong (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is an equi...