US Patent Issued to SAMSUNG ELECTRONICS on July 1 for "Bonding defect detection for die-to-die bonding in memory devices" (South Korean Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,510, issued on July 1, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (South Korea).

"Bonding defect detection for die-to-die bonding in memory devices" was invented by Junyoung Ko (Suwon-si, South Korea), Jungmin Bak (Suwon-si, South Korea) and Changhwi Park (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device may include: a memory device that includes a memory cell, a page buffer, and a first switch having a first end that is electrically connected to a first node located at a bonding point of the memory cell and a second end that is connected to a second node located at the page buffer; and a memory controller...