US Patent Issued to SAMSUNG ELECTRONICS on Jan. 28 for "Strip substrate having protection pattern on sidewall of conductive dummy pattern and semiconductor package having the same" (South Korean Inventor)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,783, issued on Jan. 28, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-Do, South Korea).

"Strip substrate having protection pattern on sidewall of conductive dummy pattern and semiconductor package having the same" was invented by Sunnyeong Jung (Asan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a strip substrate including a dielectric layer that has a plurality of unit regions spaced apart from each other in a first direction and a saw line region between the unit regions, a plurality of conductive dummy patterns on corresponding unit regions of the dielectric layer, a plurality of saw line patterns on the saw...