US Patent Issued to SAMSUNG ELECTRONICS on Jan. 28 for "Semiconductor package with dummy pattern not electrically connected to circuit pattern" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,806, issued on Jan. 28, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-Do, South Korea).

"Semiconductor package with dummy pattern not electrically connected to circuit pattern" was invented by Jin-Woo Park (Seoul, South Korea), Un-Byoung Kang (Hwaseong-si, South Korea) and Jong Ho Lee (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first substrate including a circuit pattern and a dummy pattern on an upper face of the first substrate, a solder ball, a second substrate on the first substrate, and an underfill material layer between the first and second substrates. The underfill mate...