US Patent Issued to SAMSUNG ELECTRONICS on Jan. 28 for "Semiconductor package for improving power integrity characteristics" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,213,256, issued on Jan. 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package for improving power integrity characteristics" was invented by Junghwa Kim (Seoul, South Korea), Junso Pak (Seongnam-si, South Korea), Heeseok Lee (Suwon-si, South Korea), Moonseob Jeong (Seongnam-si, South Korea) and Jisoo Hwang (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package including a circuit board including a first wiring region, a die mounting region surrounding the first wiring region, and a second wiring region surrounding the die mounting region; a plurality of wiring balls on ...