US Patent Issued to SAMSUNG ELECTRONICS on Jan. 28 for "Method for manufacturing cover member, and cover member structure" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,210,389, issued on Jan. 28, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Method for manufacturing cover member, and cover member structure" was invented by Hyunsoo Kim (Gyeonggi-do, South Korea), Sookyu Lee (Gyeonggi-do, South Korea) and Jaewoong Lim (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a cover member for electronic devices according to certain embodiments of the present disclosure may comprise: a step for forming a magnesium plate; a step for performing primary CNC processing on the magnesium plate using a predetermined cutting oil; a step for performing a primary ...