US Patent Issued to SAMSUNG ELECTRONICS on Jan. 27 for "Three-dimensional storage device using wafer-to-wafer bonding" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,842, issued on Jan. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Three-dimensional storage device using wafer-to-wafer bonding" was invented by Eun Chu Oh (Hwaseong-si, South Korea), Byungchul Jang (Suwon-si, South Korea), Junyeong Seok (Seoul, South Korea), Younggul Song (Hwaseong-si, South Korea) and Joonsung Lim (Seongnam-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a three-dimensional storage device using wafer-to-wafer bonding. A storage device includes a first chip including a first substrate and a peripheral circuit region including a first control logic circuit configured to control...