US Patent Issued to SAMSUNG ELECTRONICS on Jan. 27 for "Semiconductor package including a barrier structure covering connection pads and contacting a protruding portion of an adhesive layer" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,803, issued on Jan. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including a barrier structure covering connection pads and contacting a protruding portion of an adhesive layer" was invented by Changeun Joo (Cheonan-si, South Korea), Eunkyoung Choi (Hwaseong-si, South Korea) and Ohguk Kwon (Asan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor chip having a first surface and a second surface. First connection pads are adjacent to the first surface. A second semiconductor chip has a lower surface facing the first surface of the fir...