US Patent Issued to SAMSUNG ELECTRONICS on Jan. 27 for "Flexible circuit board and foldable electronic device comprising same" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,890, issued on Jan. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Gyeonggi-Do, South Korea).

"Flexible circuit board and foldable electronic device comprising same" was invented by Bumhee Bae (Suwon-si, South Korea), Kiman Kim (Suwon-si, South Korea), Junggil Kim (Suwon-si, South Korea), Younghun Seong (Suwon-si, South Korea) and Jeongnam Cheon (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A flexible circuit board and a foldable electronic device includes a first multi-layer region, a second multi-layer region and a highly bendable region disposed between the first multi-layer region and the second multi-layer region. The...