US Patent Issued to SAMSUNG ELECTRONICS on Jan. 20 for "Substrate processing method, substrate processing device, and method of manufacturing a semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,679, issued on Jan. 20, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Substrate processing method, substrate processing device, and method of manufacturing a semiconductor device" was invented by Ji Mo Lee (Suwon-si, South Korea), Dong Hyeon Na (Suwon-si, South Korea), Myeong Soo Shin (Suwon-si, South Korea), Woong Jin Cheon (Suwon-si, South Korea), Kyung-Sun Kim (Suwon-si, South Korea), Jae Bin Kim (Suwon-si, South Korea), Tae-Hwa Kim (Suwon-si, South Korea) and Seung Bo Shim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method is provided. The substrate processing method compr...