US Patent Issued to SAMSUNG ELECTRONICS on Jan. 20 for "Semiconductor package with semiconductor chips" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,730, issued on Jan. 20, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package with semiconductor chips" was invented by Duhyoung Ahn (Suwon-si, South Korea), Minseok Kang (Suwon-si, South Korea), Sungwook Moon (Suwon-si, South Korea) and Yongjin Hong (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor package including a three-dimensional (3D) stacked structure in which an upper second semiconductor chip is stacked on a lower first semiconductor chip. In the semiconductor package, a power distribution network for the first semiconductor chip and a power distribution...