ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,787, issued on Jan. 20, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Jung Min Ko (Suwon-si, South Korea), Hyeon Jun Song (Suwon-si, South Korea), Hyeong Mun Kang (Suwon-si, South Korea), Tae Hyeong Kim (Suwon-si, South Korea) and Young Woo Lim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package comprises a base substrate, a first semiconductor chip on the base substrate, a first dam structure which overlaps a corner of the first semiconductor chip from a plan view and is placed on the base substrate and a first fillet layer which is placed vert...