US Patent Issued to SAMSUNG ELECTRONICS on Jan. 20 for "Semiconductor package, and memory module including the same" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,756, issued on Jan. 20, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package, and memory module including the same" was invented by Seokbeom Yong (Yongin-si, South Korea), Dongchul Yang (Suwon-si, South Korea), Yunhee Lee (Seoul, South Korea) and Seungsoo Ha (Seongnam-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor package with high reliability signal characteristics and a memory module including the semiconductor package. The semiconductor package includes a package substrate, a semiconductor chip mounted on the package substrate, and connection terminals arranged on...