US Patent Issued to SAMSUNG ELECTRONICS on Jan. 20 for "Semiconductor device including semiconductor chips stacked in a multi-layer structure by a flip-chip bonding method" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,562, issued on Jan. 20, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device including semiconductor chips stacked in a multi-layer structure by a flip-chip bonding method" was invented by Hyeokjong Lee (Suwon-si, South Korea), Minho Kwon (Suwon-si, South Korea) and Kyongsoon Cho (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a first semiconductor chip having an upper surface divided into a pixel array region and a connection region, wherein a plurality of pads are disposed in the connection region; and a second semiconductor chip disposed on the first sem...