US Patent Issued to SAMSUNG ELECTRONICS on Jan. 20 for "Semiconductor device, semiconductor memory device including the same, electronic system including the same, and method for fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,727, issued on Jan. 20, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor device, semiconductor memory device including the same, electronic system including the same, and method for fabricating the same" was invented by Ju Seong Min (Seoul, South Korea), Jae-Bok Baek (Osan-si, South Korea) and Jee Hoon Han (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a lower insulating film that includes a first and second trenches on a substrate, a first wiring in the first trench, a second wiring in the second trench, a capping insulating film including an insulating...