ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,702, issued on Jan. 20, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Module tray for semiconductor device" was invented by Taegeon Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A module tray for a semiconductor device includes a base plate, and first and second sidewalls extending in a vertical direction on the base plate to define an accommodating space in which a semiconductor substrate is accommodated. The first and second sidewalls include first and second support portions and first and second fastening grooves respectively. The first and second support portions have seating surfaces for supp...