US Patent Issued to SAMSUNG ELECTRONICS on Jan. 20 for "Micro-semiconductor chip transfer apparatus and chip extraction apparatus" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,698, issued on Jan. 20, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Micro-semiconductor chip transfer apparatus and chip extraction apparatus" was invented by Dongkyun Kim (Suwon-si, South Korea), Minchul Yu (Suwon-si, South Korea), Kyungwook Hwang (Seoul, South Korea), Hyunjoon Kim (Seoul, South Korea), Joonyong Park (Suwon-si, South Korea) and Seogwoo Hong (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A micro-semiconductor chip transfer apparatus includes: a wet chip supply module configured to supply a plurality of micro-semiconductor chips and liquid onto a transfer substrate; a chip alignment ...