US Patent Issued to SAMSUNG ELECTRONICS on Jan. 20 for "Integrated circuit chip and semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,784, issued on Jan. 20, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (South, South Korea).

"Integrated circuit chip and semiconductor package" was invented by Bong Wee Yu (Anyang-si, South Korea), Eun-Hee Kim (Seoul, South Korea) and Kyoung-Min Lee (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit chip includes; a package substrate including a first signal ball, a first semiconductor chip on the package substrate, a second semiconductor chip on the first semiconductor chip, a first bump disposed between the package substrate and the first semiconductor chip and electrically connected to the first signal bal...