US Patent Issued to SAMSUNG ELECTRONICS on Jan. 20 for "Fingerprint sensor package and device including the same" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,530,920, issued on Jan. 20, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Gyeonggi-Do, South Korea).

"Fingerprint sensor package and device including the same" was invented by Hojin Seo (Suwon-si, South Korea) and Hyunggil Baek (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A fingerprint sensor package includes a substrate including a plurality of first sensing patterns spaced apart from each other in a first direction and extending in a second direction intersecting the first direction, and a plurality of second sensing patterns spaced apart from each other in the second direction and extending in the first direction; a film subs...