US Patent Issued to SAMSUNG ELECTRONICS on Jan. 13 for "Substrate loading apparatus, semiconductor manufacturing equipment including the same, and method of manufacturing a semiconductor package using the semiconductor manufacturing equipment" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,479, issued on Jan. 13, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Substrate loading apparatus, semiconductor manufacturing equipment including the same, and method of manufacturing a semiconductor package using the semiconductor manufacturing equipment" was invented by Sangho Jang (Suwon-si, South Korea), Dongsoo Lee (Suwon-si, South Korea), Kibeom Kil (Suwon-si, South Korea), Yeongseok Kim (Suwon-si, South Korea), Wooram Oh (Suwon-si, South Korea) and Youngshin Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate loading apparatus includes a pickup apparatus configured to move a magazin...