US Patent Issued to SAMSUNG ELECTRONICS on Jan. 13 for "Semiconductor packages including directly bonded pads" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,559, issued on Jan. 13, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-Si, South Korea).

"Semiconductor packages including directly bonded pads" was invented by Minki Kim (Suwon-si, South Korea) and Seungduk Baek (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package may include a first semiconductor chip and a second semiconductor chip on a top surface thereof. The first semiconductor chip may include a first bonding pad on a top surface of a first semiconductor substrate and a first penetration via on a bottom surface of the first bonding pad and penetrating the first semiconductor substrate. The seco...