US Patent Issued to SAMSUNG ELECTRONICS on Jan. 13 for "Semiconductor package including sub-package" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,585, issued on Jan. 13, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package including sub-package" was invented by Hyunsoo Chung (Hwaseong-si, South Korea), Daewoo Kim (Seongnam-si, South Korea) and Younglyong Kim (Anyang-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes; a redistribution wiring layer, a controller chip centrally disposed on the redistribution wiring layer, a first sealant disposed on the redistribution wiring layer, wherein the controller chip is buried in the first sealant, through vias connected to the redistribution wiring layer through the fi...