US Patent Issued to SAMSUNG ELECTRONICS on Jan. 13 for "Semiconductor package including stiffener" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,548, issued on Jan. 13, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package including stiffener" was invented by Jongyoun Kim (Seoul, South Korea), Eungkyu Kim (Yongin-si, South Korea), Inhyung Song (Cheonan-si, South Korea) and Hyeonseok Lee (Pyeongtaek-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate, a semiconductor stack on the package substrate, a passive device on the package substrate and spaced apart from the semiconductor stack, and a stiffener on the package substrate and extending around an outer side of the semiconductor stack. The...