US Patent Issued to SAMSUNG ELECTRONICS on Jan. 13 for "Semiconductor package including redistribution structure and passivation insulating film in contact with conductive pad" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,525, issued on Jan. 13, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package including redistribution structure and passivation insulating film in contact with conductive pad" was invented by Jiyeong Kim (Suwon-si, South Korea), Jinyoung Kim (Suwon-si, South Korea), Jihye Shim (Suwon-si, South Korea) and Okseon Yoon (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a redistribution structure including a wiring structure and an insulating structure covering the wiring structure, the redistribution structure having a first surface and a second surface, which a...