US Patent Issued to SAMSUNG ELECTRONICS on Jan. 13 for "Semiconductor package and method of manufacturing the semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,526, issued on Jan. 13, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method of manufacturing the semiconductor package" was invented by Jingu Kim (Suwon-si, South Korea), Yieok Kwon (Suwon-si, South Korea), Wooyoung Kim (Suwon-si, South Korea), Gongje Lee (Suwon-si, South Korea), Sangkyu Lee (Suwon-si, South Korea) and Bongju Cho (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a lower redistribution wiring layer; and a first semiconductor device on the lower redistribution wiring layer, the first semiconductor device being connected to the lowe...