ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,586, issued on Jan. 13, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Joonghyun Baek (Suwon-si, South Korea), Yuduk Kim (Suwon-si, South Korea) and Hyunsoo Chung (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a base chip; semiconductor chips disposed on the base chip and including front pads disposed on a front surface opposing the base chip, rear pads disposed on a rear surface opposing the front surface, and through-vias; bumps disposed between the semiconductor chips; a dam structure disposed on at least a portion of the rear p...