US Patent Issued to SAMSUNG ELECTRONICS on Jan. 13 for "Semiconductor devices and methods for manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,527,051, issued on Jan. 13, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor devices and methods for manufacturing the same" was invented by Sug Hyun Sung (Yongin-si, South Korea), Jung Gun You (Ansan-si, South Korea) and Mi Ri Joung (Seongnam-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a semiconductor device capable of improving the performance and reliability of a device. The semiconductor device comprising an active pattern including, a lower pattern extending in a first direction, and a plurality of sheet patterns spaced apart from the lower pattern in a second direction perpen...