US Patent Issued to SAMSUNG ELECTRONICS on Jan. 13 for "Semiconductor device and method for fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,527,077, issued on Jan. 13, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device and method for fabricating the same" was invented by Seung Yoon Kim (Seoul, South Korea), Jae Ryong Sim (Hwaseong-si, South Korea) and Jee Hoon Han (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes an active region that extends in a first direction and has a first width in a second direction that intersects the first direction, a first gate structure disposed on the active region that has a second width in the first direction and extends in the second direction, a first metal conta...