US Patent Issued to SAMSUNG ELECTRONICS on Jan. 13 for "Physical layer and methods for managing packet header fields" (Indian Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,526,353, issued on Jan. 13, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Physical layer and methods for managing packet header fields" was invented by Nageswara Rao Kunchapu (Karnataka, India), Krupal Jitendra Mehta (Karnataka, India), Ashwini Kumari Barimar (Karnataka, India) and Praveen S Bharadwaj (Karnataka, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for managing packet header fields in a physical (PHY) layer includes: receiving, by a header descriptor array (HDA) of a PHY layer, a data packet and a status signal of the data packet; writing, by the HDA, a header field for the received data packet; storing...