US Patent Issued to SAMSUNG ELECTRONICS on Jan. 13 for "Micro semiconductor chip transfer substrate, display transferring structure, display device, and method of manufacturing the display device" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,583, issued on Jan. 13, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Micro semiconductor chip transfer substrate, display transferring structure, display device, and method of manufacturing the display device" was invented by Junsik Hwang (Hwaseong-si, South Korea), Seogwoo Hong (Yongin-si, South Korea), Kyungwook Hwang (Seoul, South Korea), Hyunjoon Kim (Seoul, South Korea) and Joonyong Park (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to an aspect of an embodiment, provided is a micro semiconductor chip transferring substrate including: a mold including a plurality of recesses formed to ...