US Patent Issued to SAMSUNG ELECTRONICS on Jan. 13 for "Method of manufacturing semiconductor device using gas blowing agent" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,521,977, issued on Jan. 13, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Method of manufacturing semiconductor device using gas blowing agent" was invented by Cheonil Park (Seongnam-si, South Korea), Myoungchul Eum (Asan-si, South Korea) and Hwail Jin (Seongnam-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device may include bonding a carrier substrate onto a device wafer using an adhesive member, wherein the adhesive member includes a base film, a device adhesive film disposed on a lower surface of the base film and contacting the device wafer, and a carrier adhesive f...