US Patent Issued to SAMSUNG ELECTRONICS on Jan. 13 for "Method and apparatus for effectively performing header compression or decompression procedure in next-generation mobile communication system" (South Korean Inventor)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,526,691, issued on Jan. 13, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Method and apparatus for effectively performing header compression or decompression procedure in next-generation mobile communication system" was invented by Donggun Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosure relates to a communication technique and system for combining an IoT technology with a 5G communication system for supporting a higher data rate than a 4G system. The disclosure is applicable to intelligent services (e.g., smart home, smart building, smart city, smart car or connected car, healthcare, digi...