US Patent Issued to SAMSUNG ELECTRONICS on Jan. 13 for "Electronic device including electronic component assembly" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,526,495, issued on Jan. 13, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Electronic device including electronic component assembly" was invented by Jisoo Choi (Gyeonggi-do, South Korea), Jehyun Son (Gyeonggi-do, South Korea) and Dusun Choi (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "In embodiments, an electronic device comprises a housing including a printed circuit board (PCB) in an inner space thereof, and a camera module assembly disposed in the inner space and including: a module housing; a first camera module having a first camera housing, the first camera module disposed in at least a part of ...