US Patent Issued to SAMSUNG ELECTRONICS on Feb. 4 for "Wafer processing apparatus including EFEM and method of processing wafer" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,217,984, issued on Feb. 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Wafer processing apparatus including EFEM and method of processing wafer" was invented by Jinhyuk Choi (Suwon-si, South Korea), Myungki Song (Hwaseong-si, South Korea), Kongwoo Lee (Seoul, South Korea), Kyusang Lee (Suwon-si, South Korea), Beomsoo Hwang (Seoul, South Korea), Keonwoo Kim (Yongin-si, South Korea) and Jonghwi Seo (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer processing apparatus may include a plurality of equipment front end modules (EFEMs), a wafer transfer chamber, a wafer processing chamber, and a wafer transf...